Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
권호 표지
DOI QR코드

DOI QR Code

Interfacial Adhesion and Reliability between Epoxy Resin and Polyimide for Flexible Printed Circuit Board

연성인쇄회로기판의 에폭시수지와 폴리이미드 사이의 계면접착력 및 신뢰성 평가

  • Kim, Jeong-Kyu (Daeduck GDS Co., Ltd.) ;
  • Son, Kirak (School of Materials Science and Engineering, Andong National University) ;
  • Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
  • 김정규 (대덕GDS(주)) ;
  • 손기락 (안동대학교 신소재공학부 청정에너지소재기술연구센터) ;
  • 박영배 (안동대학교 신소재공학부 청정에너지소재기술연구센터)
  • Received : 2017.02.16
  • Accepted : 2017.03.23
  • Published : 2017.03.31
Download PDF
⟨ Previous Next ⟩

Abstract

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.

연성인쇄회로기판에서 금속 배선 도포층 에폭시수지와 폴리이미드 기판 사이의 계면접착력과 신뢰성 확보를 위해 3가지 폴리이미드 표면처리 및 열처리 조건에 따라 계면접착력 평가를 하였다. 또한 고온고습처리 조건에 따른 에폭시수지와 폴리이미드 사이의 계면 신뢰성을 $180^{\circ}$ 필 테스트를 통해 정량적으로 측정하였다. 폴리이미드 표면 KOH 전처리 전의 에폭시수지와 폴리이미드 사이의 필 강도는 29.4 g/mm이지만, $85^{\circ}C/85%$상대습도의 고온고습 환경에서 100 시간이 지난 후 10.5 g/mm로 감소하였다. 그러나, 폴리이미드 표면처리 후 열처리를 한 경우 29.6 g/mm의 필강도값을 가지며, 고온고습 환경 후에도 27.5 g/mm로 유지되었다. 파면 미세구조 분석 및 박리면 X-선 광전자 분광법 분석 결과, 폴리이미드 표면 습식 개질전처리 후 적절한 열처리를 하는 경우 폴리이미드 표면 잔류 불순물들의 효과적인 제거 및 습식공정에 의한 폴리이미드 손상 회복으로 인해, 고온고습환경에서도 계면접착력이 높게 유지되는 것으로 생각된다.

Keywords

References

  1. B. J. Shim, Y. Choi, and J. S. Yi, "Improvement of COF Bending-induced Lead Broken Failure in LCD Module", J. KIEEME 21, 265 (2008).
  2. B. J. Kim, M. H. Jeong, S. H. Hwang, H. Y. Lee, S. W. Lee, K. D. Chun, Y. B. Park, and Y. C. Joo, "Relationship between Tensile Characteristics and Failure by Folding or Bending in Cu Foil on Flexible Substrate", J. Microelectron. Packag. Soc., 18(1), 55 (2011).
  3. S. J. Krumbein, "Metallic electromigration phenomena", IEEE Trans. Compon. Hybrids, Manufact. Tecnol, 11, 5 (1988). https://doi.org/10.1109/33.2957
  4. S. B. Lee, Y. R. Yoo, J. Y. Jung, Y. B. Park, Y. S. Kim and Y. C. Joo, "Electrochemical Migration Characteristics of Eutectic SnPb Solder alloy in Printed Circuit Board", Thin Solid Films, 504, 294 (2006). https://doi.org/10.1016/j.tsf.2005.09.022
  5. J. Y. Jung, S. B. Lee, Y. R. Yoo, Y. S. Kim, Y. C. Joo, Y. B. Park, "Dominant Migration Element in Electrochemical Migration of Eutectic SnPb Solder Alloy in D. I. Water and NaCl Solutions", J. Microelectron. Packag. Soc., 13(3), 1. (2006).
  6. H. Tanaka, and K. S. Kim, "Introduction of Reliability Test Technology for Electronics Package", J. Microelectron. Packag. Soc., 19(1), 1. (2012). https://doi.org/10.6117/kmeps.2012.19.1.001
  7. Y. Kimura, S. Isawa, and M, Chino, "Ionic Migration Behavior in Fine Pitched Wiring on Flexible Substrate for Flat Panel Displays", 14th KGD Packaging and Test Workshop 2007, California, Die Products Consortium (DPC) (2007).
  8. D. Y. Shin, D. Y. Park, and B. K. Koo, "Effect of Current Density and Solution pH on Properties of Electrodeposited Cu Thin Films from Sulfate Baths for FCCL Applications", J. Kor. Inst. Surf. Eng., 42, 145 (2009). https://doi.org/10.5695/JKISE.2009.42.4.145
  9. B. S. Min, K. H. Seo, W. S. Chung, I. S. Lee, and S. C. Park, "Application of Plasma Cleaning for Plating Pretreatment", J. Kor. Inst. Met. & Mater., 40, 886 (2002).
  10. A. Ebe, E Takahashi, Y. Iwamoto, N. Kuratani, S. Nishiyama, O. Imai K. Ogata, Y. Setsuhara, and S. Miyake, "Improvement of the adhesion to polyimide substrates of copper films prepared by an ion beam and vapor deposition method", Thin Solid Films, 281, 356, (1996).
  11. S. H. Kim, "Ammonia Treatment of Polyimide Film", J. Kor. Fiber Soc., 31, 57 (1994).
  12. K. J. Min, S. C. Park, K. H. Lee, Y. S. Jeong, and Y. B. Park, "Effect of Wet Chemical Pretreatment Conditions on the Interfacial Adhesion Energy between Electroless-Plated Ni and Polyimide Films", Jpn. J. Appl. Phys., 49, 08JK01 (2010).
  13. H. J. Kim, Y. J. Park, J. H. Choi, H. S. Han, and Y. T. Hong, "Surface modification of polyimide film by coupling reaction for copper metallization", J. Industr. Engin. Chemi., 15, 23 (2009). https://doi.org/10.1016/j.jiec.2008.08.016
  14. H. K. Yun, K. Cho, J. K. Kim, C. E. Park, S. M. Sim, S. Y. Oh, and M. Park, "Adhesion improvement of epoxy resin/ polyimide joints by amine treatment of polyimide surface", Polymer, 38, 827 (1997). https://doi.org/10.1016/S0032-3861(96)00592-7
  15. S. R. Kim, and H. Y. Lee, "Measurement of Adhesion", Journal of Adhesion and Interface., 4, 21 (2003).
  16. S. C. Park, K. J. Min, K. H. Lee, Y. S. Jeong, and Y. B. Park, "Effect of Annealing on the Interfacial Adhesion Energy between Electroless-Plated Ni and Polyimide", Met. Mater. Int., 17, 111 (2011). https://doi.org/10.1007/s12540-011-0215-z
  17. S. C. Park, J. W. Kim, K. H. Kim, S. H. Park, Y. M. Lee, and Y. B. Park, "Interfacial Adhesion between Screen-Printed Ag and Epoxy Resin-Coated Polyimide", J. Microelectron. Packag. Soc., 17(1), 41. (2010).
  18. C. D. Wagner, W. M. Riggs, L. E. Davis and J. F. Moulder, "Handbook of X-ray Photoelectron Spectroscopy", pp.56, 84, Perkin-Elmer, U.S.A (1978).
  19. K. J. Min, M. H. Jeong, K. H. Lee, Y. S. Jeong, and Y. B. Park, "Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion of Electroless-plated Ni on Polyimide", J. Kor. Inst. Met. & Mater., 47, 10 (2009).