Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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A Study on Electrostatic Chuck Cooling by Ceramic Dielectric Material and Coolant path

세라믹 유전체 물질과 냉매 유로 형상에 따른 정전척 냉각에 관한 연구

  • Kim, Daehyeon (Department of Mechatronics Engineering, Korea University of Technology and Education) ;
  • Kim, Kwangsun (Department of Mechatronics Engineering, Korea University of Technology and Education)
  • 김대현 (한국기술교육대학교 대학원 메카트로닉스공학과) ;
  • 김광선 (한국기술교육대학교 메카트로닉스공학부)
  • Received : 2018.09.12
  • Accepted : 2018.09.19
  • Published : 2018.09.30
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Abstract

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials and inner coolant path on the chuck surface. Finally this study suggests the best cooling condition of electrostatic chuck.

Keywords

References

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