DOI QR코드

DOI QR Code

An Experimental Study on Cooling Characteristic according to Fin Array of Aluminum Heat Sink

히트싱크의 핀 배열에 따른 냉각특성에 관한 실험적 연구

  • Yoon, Sung-Un (Dept. of Mechanical Engineering, Chosun University) ;
  • Kim, Jae-Yeol (Dept. of Mechanical System & Automotive Engineering, Chosun University) ;
  • Gao, Jia-Chen (Dept. of Mechanical System Engineering, Graduate School of Chosun University)
  • 윤성운 (조선대학교 기계공학과) ;
  • 김재열 (조선대학교 기계시스템.미래자동차공학부) ;
  • 고가진 (조선대학교 일반대학원 기계시스템공학과)
  • Received : 2018.01.31
  • Accepted : 2018.02.12
  • Published : 2018.02.28

Abstract

In general, the operating temperature of electronic equipment is closely related to product life and reliability, and it is recognized that effectively cooling the parts is an important problem. In this paper, an experimental study on the cooling characteristic according to the pin array of the heat sink is conducted. The experiment on the heat sink was based on the natural convection and temperature distribution changes. The experimental results indicate that the pin array of the heat sink has an effect on the thermoelectric module's cooling characteristic.

Keywords

References

  1. Chun, H. W., Moon, S. F., "Application Trends Thermoelectric Materials", ETRI, Vol. 30, No. 1, pp.144-153, 2015.
  2. Gao, J. Ch., "Reliability Evaluation of Thermoelectric ModuleBy Non-Contact Air Coupled Ultrasonic Testing Method", 2015.
  3. Lee, M., Kim, T. W., "A Study on the Heat Sink with internal structure using Peltier Module In the Natural and Forced Convection", Journal of the Korea Academia-Industrial Cooperation Society, Vol. 15, No. 7, pp. 4072-4080, 2014. https://doi.org/10.5762/KAIS.2014.15.7.4072
  4. Jun, T. S., Kang, H. K., "Investigation of Natural Convective Heat Flow Characteristics of Heat Sink", Trans. Korean Soc. Mech. Eng. B, Vol. 37, No. 1, pp. 27-33, 2013. https://doi.org/10.3795/KSME-B.2013.37.1.027
  5. Yu, S. H., Lee, K. S., Yook, S. J., "Natural convection around a radial heat sink", International Journal of Heat and Mass Transfer, Vol. 53, pp. 2935-2938, 2010. https://doi.org/10.1016/j.ijheatmasstransfer.2010.02.032
  6. R. Arularasan & R. Velraj, "Modeling and simulation of a parallel plate heat sink using computational fluid dynamics", Int J Adv Manuf Technol, Vol. 51, pp. 415-419, 2010. https://doi.org/10.1007/s00170-008-1867-9
  7. Cho, Y. T., Lee, Ch. H., "Performance Evaluation of Heat Radiant for 50W LED by the CNT Thermal Interface Material", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 13 No. 6, pp. 23-29, 2014. https://doi.org/10.14775/ksmpe.2014.13.6.023
  8. Kwon, H. H., "Development of Hybrid Composite Die for the Production of the Supercapacitor", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 14, No. 1, pp. 105-110, 2015. https://doi.org/10.14775/ksmpe.2015.14.1.105

Cited by

  1. A Study on Cooling Characteristics of the LED Lamp Heat Sink for Automobile by Forced Convection vol.17, pp.6, 2018, https://doi.org/10.14775/ksmpe.2018.17.6.117