Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Effect of Shear Deformation During Drawing on Inhomogeneous Microstructures and Textures in High Purity Copper Wires After Annealing

고순도 구리 선재의 어닐링 후 불균질 미세조직과 집합조직에 미치는 신선 시 전단 변형의 영향

  • Park, Hyun (Department of Metallurgical Engineering, Dong-A University) ;
  • Kim, Sang-Hyeok (Department of Metallurgical Engineering, Dong-A University) ;
  • Kim, Se-Jong (Materials Deformation Department, Light Metal Division, Korea Institute of Materials Science) ;
  • Lee, Hyo-Jong (Department of Metallurgical Engineering, Dong-A University)
  • 박현 (동아대학교신소재공학과) ;
  • 김상혁 (동아대학교신소재공학과) ;
  • 김세종 (한국기계연구원부설재료연구소경량금속연구단변형제어연구실) ;
  • 이효종 (동아대학교신소재공학과)
  • Received : 2018.09.12
  • Accepted : 2018.10.08
  • Published : 2018.12.05
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Abstract

To determine the origin of the inhomogeneous microstructure and texture observed in drawn and annealed high purity copper wires, two kinds of drawing process conditions and their influence was investigated. The regular condition, based on a symmetric die, and a condition designed intentionally to produce an inhomogeneous shear deformation using an asymmetric die were employed. The difference in intensity of <111>-<100> distributed texture between the two wires confirmed that the wire drawn under the asymmetric die condition experienced a higher amount of shear deformation. The extensive shear strain in the wire drawn under the asymmetric die condition gave rise to inhomogeneous primary and secondary recrystallization behavior. After annealing at $200^{\circ}C$, grains with <100> texture, which were larger than the surrounding recrystallized grains, were extensively present on one half circle of the wire drawn under the asymmetric die condition, while larger grains with <100> were sparsely observed around the middle region of the wire drawn under the regular condition. Interestingly, the area where the larger grains with <100> texture existed was identical to the area where the high shear strain occurred during drawing in both wires. During annealing at $400^{\circ}C$, grains with <112> texture started to grow abnormally at the center of both wires as a result of secondary recrystallization. After annealing at $900^{\circ}C$ grains with <112> due to secondary recrystallization occupied the entire region of the wire drawn under the regular condition. On the other hand, in the wire drawn under the asymmetric die condition and then annealed at $900^{\circ}C$, the <100> oriented grains as a result of the normal grain growth of the larger <100> grains which were observed after annealing at $200^{\circ}C$, coexisted with the abnormally grown <112> grains. These results indicate that dynamic recrystallization induced by the shear strain during drawing plays an important role in the inhomogeneity of the microstructure and texture of wires after annealing.

Keywords

Acknowledgement

Supported by : 한국연구재단

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