Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Influence of Change of Ni Concentration in Baths Fabricated by Dissolving Metal Ni Powders on Properties of Electrodeposited Ni Film

금속 Ni 분말을 용해하여 제조된 용액에서 Ni 농도 변화가 전기도금 된 Ni 필름 특성에 미치는 영향

  • Yoon, Pilgeun (Department of Advanced Materials Engineering, Hanbat National University) ;
  • Park, Deok-Yong (Department of Advanced Materials Engineering, Hanbat National University)
  • 윤필근 (한밭대학교 신소재공학과) ;
  • 박덕용 (한밭대학교 신소재공학과)
  • Received : 2018.12.26
  • Accepted : 2019.01.24
  • Published : 2019.04.30
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Abstract

Chloride baths for electrodeposited Ni thin films were fabricated by dissolving metal Ni powders with the mixed solution consisting of HCl and de-ionized water. Current efficiency, residual stress, surface morphology and microstructure of Ni films with the change of metal ion ($Ni^{2+}$) concentrations in the plating solution were studied. Current efficiency was measured to be more than 90% with increasing $Ni^{2+}$ concentrations in the plating solution. Residual stress of Ni thin film was increased from about 400 to 780 MPa with increasing $Ni^{2+}$ concentration from 0.2 to 0.5 M. It is gradually decreased to 650 MPa at 0.9 M $Ni^{2+}$ concentration. Smooth surface morphologies were observed over 0.3 M $Ni^{2+}$ concentration, but nodule surface morphology at 0.2 M. Ni films consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks in XRD patterns. Preferred orientation of FCC(111) was observed and its intensity was slightly decreased with increasing $Ni^{2+}$ concentration. The average grain size was slightly increased at 0.3 M $Ni^{2+}$ concentration and then slightly decreased with increasing $Ni^{2+}$ concentration.

Keywords

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Fig. 1. Current efficiency and residual stress of Ni thin films electrodeposited on Cu test strip as a function of Ni concentrations in the baths: (a) current efficiency and (b) residual stress. Data points of 0.2 and 0.7 M were quoted from the Ref. no. [7].

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Fig. 2. Dependence of surface morphology of Ni thin films coated on Cu test strip as a function of Ni concentrations in the baths: (a) 0.2 M, (b) 0.3 M, (c) 0.5 M, (d) 0.7 M and (d) 0.9 M.

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Fig. 3. XRD patterns of Ni thin films coated on Cu test strip as a function of Ni concentrations in the plating baths. XRD patterns of 0.2 and 0.7 M were quoted from the Ref. no. [6] and [7], respectively.

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Fig. 4. Average crystalline size calculated from the peaks in XRD pattern for Ni thin films coated on Cu test strip as a function of Ni concentrations in the baths. Data points of 0.2 and 0.7 M were quoted from the Ref. no. [6] and [7], respectively.

Table 1 Bath compositions and operating conditions (unless otherwise noted) for Ni thin films electrodeposited from chloride baths.

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