Journal of the Korean Ceramic Society (한국세라믹학회지)

The Korean Ceramic Society (한국세라믹학회)
권호 표지

Fabrication of Low Temperature Cofired Ceramic (LTCC) Chip Couplers for High Frequencies ; II. Effect of Sintering Process on Ag Diffusion

고주파용 저온 동시소성 세라믹(LTCC)칩 커플러 제조: II. Ag 이온 확산에 대한 소결공정의 영향

  • 이선우 (한양대학교 세라믹소재 연구소) ;
  • 김경훈 (한양대학교 세라믹공정연구센터) ;
  • 심광보 (한양대학교 세라믹공정연구센터) ;
  • 구기덕 ((주)케이세라)
  • Published : 1999.05.01
Download PDF
⟨ Previous Next ⟩

Abstract

The sintering behavior of LTCC (low temperature cofired ceramics) chip couplers was investigated in relation with Ag diffusion at the interface of glass ceramic substrate-Ag electrode. Sintering temperature was in the range of 825$^{\circ}C$-975$^{\circ}C$. The commercial green sheet and silver electrode were used. Below 875$^{\circ}C$ the diffusion of the Ag ion into the substrate and the penetration of glassy phases into the electrode occurred due to an increase of fluidity. Thus the lectrode line was severely deformed and damaged. At 975$^{\circ}C$ the transformation of crystalline phases into glassy phases and the melting of the Ag electrode resulted in the diffusion of the considerable amount of Ag ions.

Keywords

References

  1. ISHM 94 Proceedings Multifunctional Ceramic Substrates and Packages for Telecommunication Applications C. Makihara;Ikeda;H. Wada;Y. Sawa;S. Tanahashi
  2. ISHM 96 Proceedings High Current Integrated Microinductors and Microtransformers using Low Temperature Fabrication Processes J. Y. Park;M. G. Allen
  3. ISHM 96 Proceedings Three Dimensional Flip Chip Packaging in LTCC for High Density Microwave Applications W. Marsh;M. Kline;F. Kuss;D. Strack
  4. IMC 1996 Proceedings Advanced Ceramic Multilayer funtional Packages for Telecommunications Equipment H. Mandai;N. Nakajima;K. Tongegawa
  5. ISHM 89 Proceedings Evaluation and Characterization of Low-Temperature Cofired Ceramic Structures for Microwave Applications J. R. Tyler;D.J. Gasper
  6. J. Am. Ceram. Soc. v.74 no.5 Ceramic and Glass-Ceramic Packaging in the 1990s R. R. Tummala
  7. JSHM 88 Proceedings Low Temperature Cofired CeramicTape System A Cost Effective Solution for Multilayer Packaging M.F. Bender;F.K. Patterson;E.A. Kemp;J.E. Gantzhorn,Jr.
  8. Proceeding of International Microelectronics Conference Co-Firable Copper Multilayered Ceramic Substrate T. Nishimura;S. Nakatani
  9. ISHM 96 Proceedings The Effect of Processing Parameters and Surface Roughness of Conductor Traces on the Microwave Properties of LTCC Structure S. Vasudevan
  10. ISHM 94 Proceedings Reliability Analysis of LTCC MCM's Utilizing Silver Conductives T. Martin;D. Schroeder
  11. ISHM 92 Proceedings Real Time Sintering Observations of LTCC Substrate and Conductor Materials W. S. Hackenberger;T. R. Shrout;J. P. Dougherty;R. F. Speyer
  12. 요업학회지 고주파용 저온 동시소성 세라믹(LTCC) 칩 커플러 제조 : I. 전극형성에 대한 결합제 분해공정의 영향 조남태;심광보;이선우;구기덕
  13. Scanning Electron Microscopy and X-ray Microanalysis : Chap. 3 Electron-Specimen Interaction J. I. Goldstein;A. D. Romig, Jr.;D. E. Newbury;C. E. Lyman;P. Echlin;C. Fiori;D. C. Joy;E. Lifshin