Korean Journal of Air-Conditioning and Refrigeration Engineering (설비공학논문집)

The Society of Air-Conditioning and Refrigerating Engineers of Korea (대한설비공학회)
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Cooling Characteristics on the Forced Convection of an Array of Electronic Components in Channel Flow (II) - The Effect of the Reynolds Number (without the Heat Sink) -

채널 유동장 내에 배열된 전자부품의 강제대류 냉각특성에 관한 연구(II) -레이놀즈 수의 영향(히트싱크가 부착되지 않은 경우)-

  • Published : 2006.06.01
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Abstract

Present study is concerned with an experimental study on the cooling characteristics of heat-generating components arranged in channels which are made by printed circuit boards. To estimate the thermal performance of the heat-generating components arranged by $5\times11$ in channel flow, three variables are used: the inlet velocity, the height of channel, and row number of the component. The cooling characteristics of the heat-generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. The experimental result is in a good agreement with the numerical analysis. The heat transfer coefficient increases as the Reynolds number increases, while the thermal wake function calculated for each row decreases as the Reynolds number increases. In addition, it is found that Nu-Re correlation equation is Identical to the previous studies, and the empirical correlation equation between the thermal wake function and Re is presented.

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References

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