Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Ultrasonic Bonding Technology for Flip Chip Packaging

플립칩 패키징을 위한 초음파 접합 기술

  • 구자명 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) ;
  • 김종웅 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) ;
  • 윤정원 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) ;
  • 노보인 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) ;
  • 이창용 (성균관대학교 신소재공학과) ;
  • 문정훈 (수원과학대학 기계과) ;
  • 유중돈 (KAIST 기계공학과) ;
  • 정승부 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
  • Published : 2008.02.28
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Abstract

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References

  1. J.W. Yoon, W.C. Moon and S.B. Jung: Core technology of electronic packaging, Journal of KWS, 23-2 (2005), 116-123 (in Korean)
  2. 유영준: Automotive Electronics의 현황과 전망, 전자정보센터 (http://www.eic.re.kr), (2006) (in Korean)
  3. J.W. Yoon, J.W. Kim, J.M. Koo, S.S. Ha, B.I. Noh, W.C. Moon. J.H. Moon and S.B. Jung: Flip-chip technology and reliability of electronic packaging, Journal of KWS, 25-2 (2007), 108-117 (in Korean) https://doi.org/10.5781/KWJS.2007.25.2.006
  4. J.M. Koo, J.H. Moon and S.B. Jung, Ultrasonic Bonding of Au Flip Chip Bump for CMOS Image Sensor, Journal of Microelectronics & Packaging Society, 14 (2007) 19 (in Korean)
  5. Materials & Components Roadmap RFP Report, Korea Industrial Technology Foundation (2007. 03.) (in Korean)
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  8. 홍성제: 디스플레이용 소재 기술동향 (이방성 전도 필름), 전자정보센터 (http://www.eic.re.kr), (2005) (in Korean)
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  13. J.M. Koo, J.L. Jo, J.B. Lee, Y.N. Kim, J.W. Kim, B.I. Noh, J.H. Moon, D.U. Kim and S.B. Jung: Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip Chip Bump on Glass Substrate, Japanese Journal of Applied Physics, In-Press
  14. J.M. Koo, J.W. Yoon, J.H. Moon and S.B. Jung: Effect of Bonding Parameters on Ultrasonic Flip Chip Bonding of Au-to-Cu Interconnection, International Congress on Ultrasonics (2007) 225
  15. J.M. Koo, Y.N. Kim, J.B. Lee, J.W. Kim, S.S. Ha, S.H. Won, S.J. Suh, M.S. Shin, P.W. Cheon, J.J. Lee and S.B. Jung: Ultrasonic Bonding of Au Stud Flip Chip Bump on Flexible Printed Circuit Board, Journal of the Microelectronics & Packaging Society, 14-4 (2007) 79-85 (in Korean)

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