Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
권호 표지

Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion of Electroless-plated Ni on Polyimide

고온다습처리 조건이 무전해 니켈 도금 박막과 폴리이미드 사이의 계면 접착력에 미치는 영향

  • Min, Kyoung-Jin (The Center for Green Materials Technology, School of Material Science and Engineering, Andong National University) ;
  • Jeong, Myeong-Hyeok (The Center for Green Materials Technology, School of Material Science and Engineering, Andong National University) ;
  • Lee, Kyu-Hwan (Department of Surface Technology, Korea Institute of Materials Science) ;
  • Jeong, Yong-Soo (Department of Surface Technology, Korea Institute of Materials Science) ;
  • Park, Young-Bae (The Center for Green Materials Technology, School of Material Science and Engineering, Andong National University)
  • 민경진 (안동대학교 신소재공학부 청정소재기술연구센터) ;
  • 정명혁 (안동대학교 신소재공학부 청정소재기술연구센터) ;
  • 이규환 (한국기계연구원 부설재료연구소 표면기술연구부) ;
  • 정용수 (한국기계연구원 부설재료연구소 표면기술연구부) ;
  • 박영배 (안동대학교 신소재공학부 청정소재기술연구센터)
  • Received : 2009.05.04
  • Published : 2009.10.25
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Abstract

Effects of $85^{\circ}C/85%$ Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a $180^{\circ}$ peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from $37.4{\pm}5.6g/mm$ to $22.0{\pm}2.7g/mm$ for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself.

Keywords

Acknowledgement

Supported by : 재료연구소

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