Journal of the Korea Academia-Industrial cooperation Society (한국산학기술학회논문지)

The Korea Academia-Industrial cooperation Society (한국산학기술학회)
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Optimization of Thermal Deformation in Probe Card

프로브 카드의 열변형 최적화

  • Chang, Yong-Hoon (Department of Mechanical and Automotive Engineering, Induk University) ;
  • Yin, Jeong-Je (Department of Mechanical Engineering Design, Induk University) ;
  • Suh, Yong-S. (Department of Mechanical Engineering, California State University)
  • Received : 2010.10.26
  • Accepted : 2010.11.19
  • Published : 2010.11.30
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Abstract

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

프로브 카드는 웨이퍼의 칩 검사에 사용된다. 또한 반도체의 고집적화에 따른 미세피치 대응으로 높은 위치 정도가 요구된다. 그러나 실제 장비에서는 하부 척에서 높은 열이 프로브 카드로 전달되어, 프로브 카드의 열변형을 초래하게 된다. 프로브 카드의 수직방향 열변형은 핀의 접촉관련 문제를 야기할 것이고, 수평방향의 열변형은 x-y 방향으로의 위치 오차를 만들 것이다. 따라서 프로브 카드는 허용 범위내의 열변형이 이루어지도록 재질과 구조를 갖게 설계되어야 한다. 본 연구에서는 유한요소 해석프로그램인 ANSYS$^{TM}$를 이용하여 프로브 카드의 실제 부하 조건들을 적용한 열전달 해석을 수행하였다. 정상상태 온도 구배에 대해 열변형이 계산되었으며, 최종적으로 적절한 설계변수들을 조정하여 열변형이 최소화 될 수 있는 새로운 구조를 제안하였다.

Keywords

References

  1. C.H. Min and T.S. Kim, "Development and Characterization of Vertical Type Probe Card for High Density Probing Test", Journal of the Korean Institute of Electrical and Electronic Material Engineers, Vol. 19, No. 9, pp. 825-831, September 2006. https://doi.org/10.4313/JKEM.2006.19.9.825
  2. J.T. Chiu, D.Y. Chang, "A new probe design combining finite element method and optimization used for vertical probe card in wafer probing", Precision Engineering, Volume 33, Issue 4, pp.395-401, 2009. https://doi.org/10.1016/j.precisioneng.2008.10.007
  3. C.H. Min and T.S. Kim, "Development of 121 pins/mm^2 High Density Probe Card using Micro-spring Architecture", Journal of the Korean Institute of Electrical and Electronic Material Engineers, Vol. 20, No. 9, pp. 749-755, September 2007. https://doi.org/10.4313/JKEM.2007.20.9.749
  4. H.J. Lee, J.Y. Kim, S.J. Lee, H.J. Choi, K.S. Kim and J.H. Kim, "Reliability Design of MEMS based on the Physics of Failures by Stress & Surface Force", Proceedings of the KSME Conference, pp. 1730-1733, 2007.
  5. S. Ha, D. Kim, B. Shin, M. Cho and C. Han, "Assessment of Design and Mechanical Characteristics of MEMS Probe Tip with Fine Pitch", Journal of the Korea Academia-Industrial cooperation Society, Vol. 11, No. 4, pp. 1210-1215, 2010. https://doi.org/10.5762/KAIS.2010.11.4.1210
  6. R. Schwartz, "Probe Card Metrology: High Temperature Testing of Probe Cards", IEEE Semiconductor Wafer Test Workshop, 2002.
  7. S.S Lee, J.Y. Yun and M.K. Kim, "Surface Thermal Deformation of 12 inch hot-cold chuck", Proceedings of the Korean Society Of Semiconductor Equipment Technology, pp. 207-211, 2003.
  8. Y. Joo, H. Shin and M.K. Kang, "A Study of Improvement of Low Temperature Uniformity of Wafer Prober Chuck", Journal of the Korea Academia-Industrial cooperation Society Vol. 10, No. 10, pp. 2572-2576, 2009. https://doi.org/10.5762/KAIS.2009.10.10.2572
  9. H.S. Lee, "Thermophysical Properties of PWB for Microelectronic Packages with Solder Resist Coating Process", Journal of the Microelectronics & Packaging Society, Vol. 10, No. 3, pp. 73-82, 2003.
  10. Gunther Boehm, "Prober Stability with Large Probing Area and High Pin count", 2006 SWTW (South West Test Workshop)