Metals and materials international

The Korean Institute of Metals and Materials (대한금속재료학회)
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Effect of Ni-Cr Seed Layer Thickness on the Adhesion Characteristics of Flexible Copper Clad Laminates Fabricated using a Roll-to-Roll Process

  • Noh, Bo-In (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Yoon, Jeong-Won (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
  • Received : 2009.10.16
  • Accepted : 2010.04.26
  • Published : 2010.10.01
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Abstract

The adhesion strength of a Cu/Ni-Cr/polyimide flexible copper clad laminate (FCCL), which was manufactured via a roll-to-roll process, was evaluated according to the thickness of the Ni-Cr seed layer using a $90^{\circ}$ peel test. The changes in the morphology, chemical bonding, and adhesion properties were characterized using a scanning electron microscopy (SEM), an atomic force microscopy (AFM), and an X-ray photoelectron spectroscopy (XPS). The thickness of the Ni-Cr (Ni:Cr = 80:20) seed layer in which the maximum peel strength of the FCCL was observed was $200{\AA}$. The higher FCCL peel strength was attributed to the lower proportion of C-N bonds and higher proportion of C-O and carbonyl (C = O) bonds in the polyimide surface compared with the FCCL with a lower adhesion strength. The FCCL with a higher peel strength had a fractured polyimide surface with a higher surface roughness. The adhesion strength between the metal and polyimide was pirmarily attributed to the chemical interaction between the metal layer and the functional groups of the polyimide.

Keywords

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