A Study on the Fracture Mode Characteristics of Automotive Application Component Lead-free Solder Joints

자동차 전장부품 무연솔더 접합부의 파괴모드 특성에 관한 연구

  • Jeon, Yu-Jae (Graduate School of Mechanical Engineering, Chung-Ang University) ;
  • Kim, Do-Seok (School of Mechanical Engineering, Chung-Ang University) ;
  • Shin, Young-Eui (School of Mechanical Engineering, Chung-Ang University)
  • 전유재 (중앙대학교 대학원 기계공학부) ;
  • 김도석 (중앙대학교 기계공학부) ;
  • 신영의 (중앙대학교 기계공학부)
  • Received : 2011.02.14
  • Accepted : 2011.06.27
  • Published : 2011.11.01

Abstract

In this study, the characteristic of fractured portion and shape on solder joints were investigated according to the thermal shock test for Automotive Application Component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as Lead-free solder. The value of pull and shear strength was decreased in principle after 432 cycles thermal shock test. In addition, fracture mode was verified by using EDS and SEM to observe fractured shape on the solder joints before and after thermal shock. In before thermal shock test, the fracture mode revealed typically solder layer's fracture mode. In after thermal shock test, we identified multiple fracture mode of the ductile and brittle fracture. Even though same composition of solder was used to experimental for estimating. the fracture mode varied on the fracture portion's height and the directional angles of shear strength. In conclusion, we identified that mechanical strength was affected on the solder layer's fracture mode.

Keywords

References

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