Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Fabrication and Reliability Test of Device Embedded Flexible Module

디바이스 내장형 플렉시블 전자 모듈 제조 및 신뢰성 평가

  • Kim, Dae Gon (Micro Device Solution Team, Samsung Techwin Co., Ltd.) ;
  • Hong, Sung Taik (Micro Device Solution Team, Samsung Techwin Co., Ltd.) ;
  • Kim, Deok Heung (Micro Device Solution Team, Samsung Techwin Co., Ltd.) ;
  • Hong, Won Sik (Components and Materials Physics Research Center, Korea Electronics Technology Institute) ;
  • Lee, Chang-Woo (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology)
  • 김대곤 (삼성테크윈 MDS 개발팀) ;
  • 홍성택 (삼성테크윈 MDS 개발팀) ;
  • 김덕흥 (삼성테크윈 MDS 개발팀) ;
  • 홍원식 (전자부품연구원 부품소재물리연구센터) ;
  • 이창우 (한국생산기술연구원 용접접합기술센터)
  • Received : 2013.06.19
  • Accepted : 2013.06.20
  • Published : 2013.06.30
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Abstract

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

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References

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Cited by

  1. Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions vol.31, pp.5, 2013, https://doi.org/10.5781/KWJS.2013.31.5.59