Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
권호 표지
DOI QR코드

DOI QR Code

Thermoplastic Fusion Bonding of UV Modified PMMA Microfluidic Devices

UV 개질된 PMMA 미세유체 장치의 열가소성 폴리머 용융 접합

  • Park, Taehyun (School of Mechanical Engineering, Kyungnam Univ.)
  • 박태현 (경남대학교 기계공학부)
  • Received : 2014.02.27
  • Accepted : 2014.03.26
  • Published : 2014.05.01
Download PDF
⟨ Previous Next ⟩

Abstract

Thermoplastic fusion bonding is widely used to seal polymer microfluidic devices and optimal bonding protocol is required to obtain a successful bonding, strong bonding force without channel deformation. Besides, UV modification of the PMMA (poly-methyl methacrylate) is commonly used for chemical or biological application before the bonding process. However, study of thermal bonding for the UV modified PMMA was not reported yet. Unlike pristine PMMA, the optimal bonding parameters of the UV modified PMMA were $103^{\circ}C$, 71 kPa, and 35 minutes. A very low aspect ratio micro channel (AR=1:100, $20{\mu}m$ depth and $2000{\mu}m$ width) was successfully bonded (over 95%, n>100). Moreover, thermal bonding of multi stack PMMA chips was successfully demonstrated in this study. The results may applicable to fabricate a complex 3 dimensional microchannel networks.

Keywords

References

  1. Mark, D., Haeberle, S., Roth, G., von Stetten, F., and Zengerle, R., "Microfluidic Lab-On-A-Chip Platforms: Requirements, Characteristics and Applications," Chemical Society Reviews, Vol. 39, No. 3, pp. 1153- 1182, 2010. https://doi.org/10.1039/b820557b
  2. Nge, P. N., Rogers, C. I., and Woolley, A. T., "Advances in Microfluidic Materials, Functions, Integration, and Applications," Chemical Reviews, Vol. 113, No. 4, pp. 2550-2583, 2013. https://doi.org/10.1021/cr300337x
  3. Becker, H. and Locascio, L. E., "Polymer Microfluidic Devices," Talanta, Vol. 56, No. 2, pp. 267-287, 2002. https://doi.org/10.1016/S0039-9140(01)00594-X
  4. Reinholt, S. J., Behrent, A., Greene, C., Kalfe, A., and Baeumner, A. J., "Isolation and Amplification of Mrna within a Simple Microfluidic Lab on a Chip," Analytical Chemistry, Vol. 86, No. 1, pp. 849-811, 2013.
  5. Lee, C. S., Kang, C. G., and Youn, S. W., "Effect of Forming Conditions on Linear Patterning of Polymer Materials by Hot Embossing Process," Int. J. Precis. Eng. Manuf., Vol. 11, No. 1, pp. 119-127, 2010. https://doi.org/10.1007/s12541-010-0015-2
  6. Klank, H., Kutter, J. P., and Geschke, O., "Co2-laser Micromachining and Back-end Processing for Rapid Production of Pmma-based Microfluidic Systems," Lab on a Chip, Vol. 2, No. 4, pp. 242-246, 2002. https://doi.org/10.1039/b206409j
  7. Tsao, C. W. and DeVoe, D. L., "Bonding of Thermoplastic Polymer Microfluidics," Microfluidics and Nanofluidics, Vol. 6, No. 1, pp. 1-16, 2009. https://doi.org/10.1007/s10404-008-0361-x
  8. Tran, H. H., Wu, W., and Lee, N. Y., "Ethanol and Uv-assisted Instantaneous Bonding of Pmma Assemblies and Tuning in Bonding Reversibility," Sensors and Actuators B: Chemical, Vol. 181, No. pp. 955-962, 2013. https://doi.org/10.1016/j.snb.2012.11.060
  9. Park, T., Song, I. H., Park, D. S., You, B. H., and Murphy, M. C.,"Thermoplastic Fusion Bonding using a Pressure-assisted Boiling Point Control System," Lab on a Chip, Vol. 12, No. 16, pp. 2799- 2802, 2012. https://doi.org/10.1039/c2lc40252a
  10. Ahn, D. G., Lee, H. J., and Ahn, Y. S., "Joining Technology of Flat Panel Photobioreactor Case," J. Korean Soc. Precis. Eng., Vol. 30, No. 2, pp. 154-163, 2013. https://doi.org/10.7736/KSPE.2013.30.2.154
  11. Cho, Y. H., Kim, S. D., and Hwang, J. H., "Curve- Typed Pmma Nanochannel Fabrication using Polymer Layer Transfer and Collapse Technique," J. Korean Soc. Precis. Eng., Vol. 29, No. 1, pp. 114-120, 2012. https://doi.org/10.7736/KSPE.2012.29.1.114
  12. Nayak, N. C., Yue, C., Lam, Y., and Tan, Y., "Thermal Bonding of Pmma: Effect of Polymer Molecular Weight," Microsystem Technologies, Vol. 16, No. 3, pp. 487-491, 2010. https://doi.org/10.1007/s00542-009-0926-y
  13. Henry, A. C., Tutt, T. J., Galloway, M., Davidson, Y. Y., McWhorter, C. S., and et al., "Surface Modification of Poly(methyl methacrylate) used in the Fabrication of Microanalytical Devices," Analytical Chemistry, Vol. 72, No. 21, pp. 5331-5337, 2000. https://doi.org/10.1021/ac000685l
  14. Sperling, L. H., "Introduction to Physical Polymer Science," John Wiley & Sons, 2005.
  15. Afifi, H. and Hasan, E., "Annealing Effect on Microhardness and Elastic Constants of Pmma," Polymer-Plastics Technology and Engineering, Vol. 42, No. 4, pp. 543-554, 2003. https://doi.org/10.1081/PPT-120023094
  16. Yu, D. I., Doh, S. W., Kwak, H. J., Ahn, H. S., Kim, M. H., and et al., "Apparent Contact Angle on the Hydrophilic/Hydrophobic Surfaces with Micropillars,"J. Korean Soc. Precis. Eng., Vol. 31, No. 2, pp. 171-178, 2014. https://doi.org/10.7736/KSPE.2014.31.2.171
  17. Long, J., Hyder, M., Huang, R., and Chen, P., "Thermodynamic Modeling of Contact Angles on Rough, Heterogeneous Surfaces," Advances in Colloid and Interface Science, Vol. 118, No. 1, pp. 173-190, 2005. https://doi.org/10.1016/j.cis.2005.07.004
  18. Tsao, C., Hromada, L., Liu, J., Kumar, P., and DeVoe, D., "Low Temperature Bonding of Pmma and Coc Microfluidic Substrates using Uv/ozone Surface Treatment," Lab on a Chip, Vol. 7, No. 4, pp. 499-505, 2007. https://doi.org/10.1039/b618901f
  19. Sun, Y., Kwok, Y. C., and Nguyen, N. T., "Low- Pressure, High-Temperature Thermal Bonding of Polymeric Microfluidic Devices and Their Applications for Electrophoretic Separation," Journal of Micromechanics and Microengineering, Vol. 16, No. 8, pp. 1681, 2006. https://doi.org/10.1088/0960-1317/16/8/033
  20. Park, D. S. W., Chen, P. C., You, B. H., Kim, N., Park, T., Lee, T. Y., and et al., "Titer Plate Formatted Continuous Flow Thermal Reactors for High Throughput Applications: Fabrication and Testing," Journal of Micromechanics and Microengineering, Vol. 20, No. 5, pp. 055003, 2010. https://doi.org/10.1088/0960-1317/20/5/055003
  21. Mathur, A., Roy, S., Tweedie, M., Mukhopadhyay, S., Mitra, S., and McLaughlin, J., "Characterisation of Pmma Microfluidic Channels and Devices Fabricated by Hot Embossing and Sealed by Direct Bonding," Current Applied Physics, Vol. 9, No. 6, pp. 1199-1202, 2009. https://doi.org/10.1016/j.cap.2009.01.007
  22. Palm, G., Castro, J., and Dupaix, R., "Large Strain Mechanical Behavior of Poly (methyl methacrylate) (pmma) near the Glass Transition Temperature," Journal of Engineering Materials and Technology, Vol. 128, No. 4, pp. 559-563, 2006. https://doi.org/10.1115/1.2345447

Cited by

  1. Numerical Analysis of the Filling Stage in Insert Injection Molding of Microfluidic Chip with Metal Electrodes vol.32, pp.11, 2015, https://doi.org/10.7736/KSPE.2015.32.11.969
  2. Investigation of Thermal Fusion Bonding and Separation of PMMA Substrates by using Molecular Dynamics Simulations vol.17, pp.5, 2018, https://doi.org/10.14775/ksmpe.2018.17.5.111