Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Fabrication of the Cu-STS-Cu Clad Metal for High Strength Electric Device Lead Frame and Thermal Stability on Their Physical Properties

고강도 전자소자 리드프레임용 Cu/STS/Cu 클래드 메탈제조 및 물리적특성에 대한 열안정성 연구

  • Kim, Il-Gwon (Advanced Materials Engineering, Seoul National University of Science and Technology) ;
  • Son, Moon-Eui (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology) ;
  • Kim, Young-Sung (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
  • 김일권 (서울과학기술대학교 신소재공학과) ;
  • 손문의 (서울과학기술대학교 NID대학원) ;
  • 김용성 (서울과학기술대학교 NID대학원)
  • Received : 2014.09.19
  • Accepted : 2014.10.13
  • Published : 2014.10.31
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Abstract

We have successfully fabricated high strengthening Cu/STS/Cu 3 layered clad metal of $70kgf/mm^2$ grade for electric device lead frame, and investigated thermal effect of the mechanical and physical properties on the Cu/STS/Cu 3 layered clad metal lead frame material at different temperatures ranging from RT to $200^{\circ}C$. The fabricated clad metal shows a good thermal stability under 6% degrading of mechanical tensile strength and hardness change at $200^{\circ}C$ and also physical properties show stable thermal and electrical conductance of over $220W/m{\cdot}K$ and 58.44% IACS upto the $200^{\circ}$. The results confirm that fabricated high strengthening Cu/STS/Cu 3 layered clad metal can be applied for the high performed electrical lead frame devices.

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References

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