References
- B. I. Noh, J. W. Yoon, W. S. Hong and S. B. Jung, "Evaluation of electrochemical migration on flexible printed circuit boards with different surface finishes", J. Electronic Materials, 38, 6 (2009).
- C. Zhang, P. Yalamnchili, M. A. Sheikhley and A. Christou, "Metal migration in epoxy encapsulated ECL devices", Microelectron. Reliab., 44, 1323 (2004). https://doi.org/10.1016/j.microrel.2004.07.021
- Y. H. Chun and L. J. Kwon, "Accelerated life test and data analysis of the silver through hole printed wiring board", J Korean Soc Qual Manag., 25(2), 15 (1997).
- K. J. Lee, K. S. Kim and K. Suganuma, "Electro-migration phenomenon in flip-chip packages", J. Microelectron. Packag. Soc., 17(4), 11 (2010).
- K. Suganuma, "Tin whisker growth in vaccum thermal cycling", Presented at 2010 TMS Annual Meeting & Exhibition, February 14-18, Seattle.
- W. S. Hong, S. B. Jung and K. B. Kim, "Analysis method of metallic ion migration", Journal of KWS, 23, 32 (2005).
- H. Tanaka and K. S. Kim, "Introduction of reliability test technology for electronics package", J. Microelectron. Packag. Soc., 19(1), 1 (2012). https://doi.org/10.6117/kmeps.2012.19.1.001
- W. J. Choi, S. H. Yoo, H. S. Lee, M. S. Kim and J. K. Kim, "Effects of hardeners on the low-temperature snap cure behaviors of epoxy adhesives for flip chip bonding", Kor. J. Mater. Res., 22, 454 (2012). https://doi.org/10.3740/MRSK.2012.22.9.454
- IPC-TM-650, Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated printed wiring (North brook, IL: The iNstitute for Interconnection and Packaging Electronic Circuits, 1985).
- K. S. Kim, K. J. Lee, K. Suganuma and S. H. Huh, "Effect of Cl content on interface characteristics of isotropic conductive adhesives/Sn plating interface", J. Microelectron. Packag. Soc., 18(3), 33 (2011).
- W. S. Hong, C. M. Oh, N. C. Park, B. S. Song and S. B. Jung, "Reliability assessment for electronic assemblies with electrical and electrochemical properties measurement", Journal of KWJS, 25, 118 (2007).
- C. H. Hare, "Paint film degradation mechanism and control", Society for Protective Coatings, (2002).
- F. Franz, W. Ralf and T. Axel, "Diffusion of metals in polymers", Materials Science and Engineering, R22, 1 (1998).
Cited by
- Lifetime Predictions of Printed Circuit Boards under Biased HAST vol.36, pp.2, 2015, https://doi.org/10.5781/jwj.2018.36.2.1
- SMT assembly effects on organic substrate lifetime reduction vol.32, pp.3, 2015, https://doi.org/10.1108/ssmt-11-2019-0036
- 실험 및 수치해석을 이용한 SLP (Substrate Like PCB) 기술에서의 마이크로 비아 신뢰성 연구 vol.27, pp.1, 2015, https://doi.org/10.6117/kmeps.2020.27.1.0045