Electronic Materials Letters

The Korean Institute of Metals and Materials (대한금속재료학회)
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High Performance Heat Curing Copper-Silver Powders Filled Electrically Conductive Adhesives

  • Cui, Hui-Wang (Institute of Scientific and Industrial Research, Osaka University) ;
  • Jiu, Jin-Ting (Institute of Scientific and Industrial Research, Osaka University) ;
  • Sugahara, Tohru (Institute of Scientific and Industrial Research, Osaka University) ;
  • Nagao, Shijo (Institute of Scientific and Industrial Research, Osaka University) ;
  • Suganuma, Katsuaki (Institute of Scientific and Industrial Research, Osaka University) ;
  • Uchida, Hiroshi (Institute for Polymers and Chemicals Business Development Center)
  • Received : 2014.09.14
  • Accepted : 2014.11.19
  • Published : 2015.03.20
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Abstract

In this study, high performance electrically conductive adhesives were fabricated from a vinyl ester resin, a thermal initiator, silver coated copper powders, and pure silver powders, without using any other coupling agent, dispersing agent, and reducing agent. The heat cured copper-silver powders filled electrically conductive adhesives presented low bulk resistivity (e.g., $4.53{\times}10^{-5}{\Omega}{\cdot}cm$) due to the silver powders that had given high electrical conductivity to the adhesives, and high shear strength (e.g., 16.22 MPa) provided by the crosslinked structures of vinyl ester resin. These high performance copper-silver powders filled electrically conductive adhesives have lower cost than those filled by pure silver powders, which can be well used in the electronic packaging and can enlarge the application prospects of electrically conductive adhesives.

Keywords

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