Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Electrical Properties of Temperature Coefficient of Resistance and Heat Radiation Structure Design for Shunt Fixed Resistor

저항 온도계수와 방열 구조설계에 따른 션트 고정 저항의 전기적 특성

  • Kim, Eun Min (Department of Metallurgical Engineering, Pukyong National University) ;
  • Kim, Hyeon Chang (Research Center, Smart Electronics Inc.) ;
  • Lee, Sunwoo (Department of Electrical Information, Inha Technical College)
  • 김은민 (부경대학교 금속공학과) ;
  • 김현창 (스마트전자 종합연구소) ;
  • 이선우 (인하공업전문대학 전기정보과)
  • Received : 2017.11.13
  • Accepted : 2017.11.22
  • Published : 2018.02.01
Download PDF
⟨ Previous Next ⟩

Abstract

In this study, we designed the temperature coefficient of resistance (TCR) and heat radiation properties of shunt fixed resistors by adjusting the atomic composition of a metal alloy resistor, and fabricated a resistor that satisfied the designed properties. Resistors with similar atomic composition of copper and nickel showed low TCR and excellent shunt fixed resistor properties such as short-time overload, rated load, humidity load, and high temperature load. Finally, we expect that improved sensor accuracy will be obtained in current-distribution-type shunt fixed resistor for IoT sensors by designing the atomic composition of the metal alloy resistor proposed in this work.

Keywords

References

  1. H. R. Kim, S. P. Hong, and S. M. Park, J. Secur. Eng., 13, 155 (2016). https://doi.org/10.14257/jse.2016.04.08
  2. K. S. Min, IITP Weekly ICT Issue, 1700, 12 (2015).
  3. F. Zandman, P. R. Simon, and J. Szwarc, Resistor Theory and Technology, 1st ed. (Vishy Inter technology Inc, Malvern, USA, 2001) p. 52.
  4. J. S. Hwang and H. J. Kim, Fixed wire wound resistors-Power type, KS C 5115-4, 15 (2001).
  5. E. M. Kim. S. C. Kim, and S. Lee, J. Korean Inst. Electr. Electron. Mater. Eng., 29, 365 (2016). [DOI: https://doi.org/10.4313/JKEM.2016.29.6.365]
  6. Y. G. Ko, C. W, Lee, S. Namkung, D. H. Lee, and D. H. Sin, Trans. Mater. Process., 18, 476 (2009). https://doi.org/10.5228/KSPP.2009.18.6.476
  7. E. M. Kim, S. H. Lee, D. K Cho, and S. H. Kim, J. Korean Trans. Electrical Eng., 63, 1070 (2014). [DOI: https://doi.org/10.5370/kiee.2014.63.8.1070]
  8. Littelfuse, http://www.littelfuse.com/products/fuses (2017).
  9. Cooper Bussmann, http://www.cooperindustries.com/content/public/en/bussmann/electrical/products (2017).
  10. S. Yarlagadda, T. T. Hartley, and I. Husain, IEEE Trans. Ind. Appl., 49, 2720 (2013). [DOI: https://doi.org/10.1109/TIA.2013.2264794]