Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint

자동차 전장용 무연솔더 및 솔더 접합부의 신뢰성 평가

  • Bang, Jung-Hwan (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Yu, Dong-Yurl (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Ko, Young-Ho (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Yoon, Jeong-Won (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Lee, Chang-Woo (Microjoining Center, Korea Institute of Industrial Technology)
  • 방정환 (한국생산기술연구원 마이크로조이닝센터) ;
  • 유동열 (한국생산기술연구원 마이크로조이닝센터) ;
  • 고용호 (한국생산기술연구원 마이크로조이닝센터) ;
  • 윤정원 (한국생산기술연구원 마이크로조이닝센터) ;
  • 이창우 (한국생산기술연구원 마이크로조이닝센터)
  • Received : 2016.02.02
  • Accepted : 2016.02.16
  • Published : 2016.02.29
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Abstract

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

Keywords

References

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Cited by

  1. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics vol.45, pp.12, 2016, https://doi.org/10.1007/s11664-016-4837-2
  2. Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST) vol.14, pp.6, 2018, https://doi.org/10.1007/s13391-018-0077-3